Molex has expanded its Nano-Pitch I/O Interconnect System portfolio with the addition of 8X cables and XD (eXtra durable) vertical board mounted connectors. Delivering data speed rates of 25 Gbps per lane, the Nano-Pitch I/O 8X Interconnect System offers industry-leading port density and multi-protocol support to internal storage, server and mobile/enterprise applications. The XD board receptacles are offered as both 4X and 8X and use four through-hole pins for maximum robustness.

Providing enhanced data speed and signal integrity in an extremely compact form factor, the multi-protocol Nano-Pitch I/O Interconnect System is compatible with all known SAS, SATA, and PCIe protocols, including PCIe Gen 4 (16 GT/s) and SAS 4 (24 Gbps). The system features a flexible pin-out concept (continuous ground-signal-signal-ground) optimized for high-speed applications and maximizing the number of high-speed lanes within the lengths provided. Eight lanes (8X) are available, per industry standard.

The small form factor (5 mm×23 mm×9 mm) and a 12 mm mated connector-to-cable assembly height for right angle cable exit allow the Nano-Pitch I/O System to meet the 14.47 mm height for components on PCIe add-in cards. This makes it ideal for systems servicing mobile devices through enterprise applications. Staggered, reliable, and constant dual-row contact configuration delivers hot plug ability which allows components to be added without shutting down the server or router. Also, the connector provides optimal routing for high-speed trace connections while reducing the need for PCB real estate.








Read Current Edition of Communications Today