Huawei and Intel have signed a memorandum of understanding (MoU) to cooperate in high-performance computing to provide competitive and innovative HPC products and solutions. According to the collaboration plan, the two parties will desire to develop HPC solutions based on Huawei servers and cloud platforms, which are powered by Intel Xeon processor, Intel Xeon Phi processors, and Omni-Path Architecture.

Huawei will also build HPC innovation centers in Shenzhen and Chengdu, China, as well as in Munich, Germany. At these centers, the two parties may carry out joint initiatives such as application optimization, technical training, and community development so that they can provide cutting-edge HPC solution experience and services for customers. Additionally, they will carry out joint exploration and marketing events across the globe.


 

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